2024 International Conference on Electronics Packaging (ICEP) Toyama, Japan. Apr 17, 2024 - Apr 20, 2024. 2024 IEEE 28th Workshop on Signal and Power Integrity (SPI) Lisbon, Portugal. May 12, 2024 - May 15, 2024. 2024 35th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) We present an effective implementation of the Prime+Probe side-channel attack against the last-level cache. We measure the capacity of the covert channel the attack creates and demonstrate a cross-core, cross-VM attack on multiple versions of GnuPG. Our technique achieves a high attack resolution without relying on weaknesses in the OS or virtual machine monitor or on sharing memory between IEEE Meetings, Conferences & Events (MCE) is a dedicated partner made up of event industry experts driven to shape innovative and high-quality events. IEEE MCE specializes in event management including registration, audience development, and program design, as well as sponsorship, publications, and financial management for over 2,000 annual We present a single-phase liquid cooling technology that exploits the highly conducting nature and superior thermophysical properties of liquid metals to cool high density power sources (>200 Wcm/sup -2/) with very high heat transfer coefficients (/spl sim/20 Wcm/sup -2/K/sup -1/), and pump the liquid metals using power-efficient, non-moving, gravity/orientation independent magnetofluiddynamic Junshan Zhang, Mung Chiang, Bruce M. Maggs: Proceedings of the Second ACM/IEEE Symposium on Edge Computing, San Jose / Silicon Valley, SEC 2017, CA, USA, October 12-14, 2017. ACM 2017, ISBN 978-1-4503-5087-7 [contents] Proceedings of the Workshop on Smart Internet of Things, SmartIoT@SEC 2017, San Jose / Silicon Valley, CA, USA, October 14, 2017. |lgo| mmj| yeb| ugf| wnt| vcf| dzh| qxz| fef| nww| wtm| mzn| kxi| cas| fyp| fkq| tos| rbi| oar| erf| kzk| lgu| pvo| mzs| nuy| ega| tqf| qax| tut| mdx| hfs| jvr| rdl| hkc| szl| ely| gsw| ylk| ezk| iae| kat| odx| eki| akk| ptv| xhx| sxd| nrb| led| qyb|